Improving the stoichiometry of RF-sputtered amorphous aluminathin films by thermal annealing
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2015
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High quality alumina thin films weredeposited on glass substrate by reactive radio-frequency sputtering. The de
position process and rate were controlled by radio-frequency power and reactive gas (oxygen) flow rate. The re
lationships between O/Al ratio contents and the structural, electrical resistivity and optical parameters of the films
were investigated. The O/Al of the films varied with change in oxygen flow ratio, power density and post deposition annealing. The structure and phase of the filmswere unaltered as the deposition parameters and post depositionannealing up to 573 Kwerevaried. O/Al of 1.5 was obtained at oxygen flow ratio of 11%, radio-frequency power of 250 W and post deposition annealing of 573 K. The sheet resistance of the films were all very high but the same within experimental uncertainties. The optical parameters (transmittance, refractive index and extinction coefficient) of the films varied considerably and dependedonthe films’ stoichiometry
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Olarinoye, I. O., & Ogundare, F. (2015). Improving the stoichiometry of RF-sputtered amorphous alumina thin films by thermal annealing. International Journal of Materials Research, 106(5), 514-520. https://doi.org/10.3139/146.111205